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INTEGRATED CIRCUITS
DATA SHEET
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT GreenChipTMII SMPS control IC
Product specification 2003 Sep 09
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
FEATURES Distinctive features * Universal mains supply operation (70 to 276 V AC) * High level of integration; giving a low external component count. Green features * Valley or zero voltage switching for minimum switching losses * Efficient quasi-resonant operation at high power levels * Frequency reduction at low power standby for improved system efficiency (3 W) * Cycle skipping mode at very low loads. Protection features * Safe restart mode for system fault conditions * Continuous mode protection by means of demagnetization detection (zero switch-on current) * Accurate and adjustable overvoltage protection (latched in TEA1506; safe restart in TEA1506A) * Short winding protection * Undervoltage protection (foldback during overload) * Overtemperature protection * Low and adjustable overcurrent protection trip level * Soft (re)start.
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
APPLICATIONS Besides typical application areas, i.e. TV and monitor supplies, the device can be used in adapters and chargers and all applications that demand an efficient and cost-effective solution up to 150 W. Unlike the other GreenChipTMII control ICs, the TEA1506 has no internal high voltage start-up source and needs to be started by means of an external bleeder resistor.
1 2 3 4
8 7 6 5
TEA1506P TEA1506AP
MDB504
Fig.1 Basic application diagram.
2003 Sep 09
2
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
GENERAL DESCRIPTION is the second generation of green The Switched Mode Power Supply (SMPS) control ICs. A high level of integration leads to a cost effective power supply with a low number of external components.
(1) GreenChip is a trademark of Koninklijke Philips Electronics N.V.
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at a reduced frequency and with valley detection. Highly efficient and reliable supplies can easily be designed using the GreenChipTMII control IC.
GreenChipTM(1)II
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1506P TEA1506AP TEA1506T TEA1506AT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 DIP8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) VERSION SOT97-1
2003 Sep 09
3
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k, full pagewidth
2003 Sep 09 4
BLOCK DIAGRAM
Philips Semiconductors
GreenChipTMII SMPS control IC
VCC
1 (2)
SUPPLY MANAGEMENT
8 (14) Iprot(DEM)
DRAIN
internal supply 2 (3)
UVLO start
VALLEY
clamp
GND
VOLTAGE CONTROLLED OSCILLATOR
4 LOGIC 100 mV (7)
DEM
FREQUENCY CONTROL
UP/DOWN COUNTER
OVERVOLTAGE PROTECTION
Iprot(CTRL) CTRL 3 (6) 3.8 V UVLO -1
LOGIC
DRIVER Iss LEB
6 (11)
DRIVER
POWER-ON RESET
S
Q blank
soft start S2
0.5 V
R
Q 5 OCP (9) Isense
S OVERTEMPERATURE PROTECTION VCC < 4.5 V or UVLO (TEA1506AT)
Q
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
R
Q
TEA1506P; TEA1506AP (TEA1506T; TEA1506 AT)
MAXIMUM ON-TIME PROTECTION
short winding
0.88 V OVERPOWER PROTECTION
MDB505
Product specification
Pin numbers in parenthesis represent the SO version.
Fig.2 Block diagram.
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
PINNING PIN SYMBOL DIP8 VCC GND CTRL DEM Isense DRIVER HVS DRAIN n.c. 1 2 3 4 5 6 7 8 - SO14 2 3 6 7 9 11 12, 13 14 1, 4, 5, 8, 10 supply voltage ground control input
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
DESCRIPTION
input from auxiliary winding for demagnetization timing; overvoltage and overpower protection programmable current sense input gate driver output high voltage safety spacer; not connected drain of external MOS switch; input for valley sensing and initial internal supply not connected
handbook, halfpage
n.c. 1
handbook, halfpage
14 DRAIN 13 HVS 12 HVS
VCC 1 GND 2
8 DRAIN
VCC 2 GND 3
TEA1506P
7 HVS n.c. 4 n.c. 5
CTRL 3 TEA1506AP 6 DRIVER DEM 4
MDB506
TEA1506T 11 DRIVER TEA1506AT
10 n.c. 9 8
MDB507
5 Isense
CTRL 6 DEM 7
Isense n.c.
Fig.3 Pin configuration DIP8.
Fig.4 Pin configuration SO14.
2003 Sep 09
5
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
FUNCTIONAL DESCRIPTION The TEA1506 is the controller of a compact flyback converter, and is situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up. The TEA1506 can operate in multi modes (see Fig.5).
V
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
MGU233
sense(max) handbook, halfpage
0.52 V
f
handbook, halfpage (kHz)
MGU508
VCO 175
fixed
quasi resonant
1V (typ)
1.5 V (typ)
VCTRL
Fig.6 Vsense(max) voltage as function of VCTRL.
25 P (W)
The moment the voltage on pin VCC drops below the undervoltage lock-out level, the IC stops switching and re-enters the safe restart mode. Supply management
Fig.5 Multi modes operation. All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit. Current mode control Current mode control is used for its good line regulation behaviour. The `on-time' is controlled by the internally inverted control voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on. The internal control voltage is inversely proportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from 0.5 to 0 V (a high external control voltage results in a low duty cycle). Oscillator The maximum fixed frequency of the oscillator is set by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changes linearly with the control voltage until the minimum frequency is reached (see Figs 6 and 7).
The next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of the primary inductance and drain capacitor ensures this quasi-resonant operation. The design can be optimized in such a way that zero voltage switching can be reached over almost the universal mains range. To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control. At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 25 kHz. Start-up and undervoltage lock-out Initially the IC is in the save restart mode. As long as VCC is below the VCC(start) level, the supply current is nearly zero. The IC will activate the converter as soon as the voltage on pin VCC passes the VCC(start) level. The IC supply is taken over by the auxiliary winding as soon as the output voltage reaches its intended level.
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Cycle skipping
f (kHz) 175
MGU509
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
handbook, halfpage
175 kHz
At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 25 kHz. If the voltage on the control pin is raised even more, switch-on of the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.8). For system accuracy, it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used. Remark: If the no-load requirement of the system is such that the output voltage can be regulated to its intended level at a switching frequency of 25 kHz or above, the cycle skipping mode will not be activated.
25 VCO2 level VCO1 level Vsense(max) (V)
Fig.7 VCO frequency as function of Vsense(max).
handbook, full pagewidth
fosc current comparator DRIVER DRIVER Isense fmin dV2 Vx V I 150 mV OSCILLATOR 1 cycle skipping dV1 150 Vx (mV)
1.5 V - VCTRL CTRL
fmax
X2
0 Vx (mV)
MGU510
The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.
Fig.8 The cycle skipping circuitry.
2003 Sep 09
7
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Demagnetization The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended. Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power level. Demagnetization recognition is suppressed during the first tsuppr time. This suppression may be necessary in applications where the transformer has a large leakage inductance, at low output voltages and at start-up. If pin DEM is open-circuit or not connected, a fault condition is assumed and the converter will stop operating immediately. Operation will recommence as soon as the fault condition is removed. Minimum and maximum `on-time' The minimum `on-time' of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the `on-time' to 50 s. When the system desires an `on-time' longer than 50 s, a fault condition is assumed (e.g. removed Ci in Fig.12), the IC will stop switching and enter the safe restart mode. OverVoltage Protection (OVP) An OVP mode is implemented in the GreenChip series. This works for the TEA1506 by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter. If the output voltage exceeds the OVP trip level, an internal counter starts counting subsequent OVP events. The counter has been added to prevent incorrect OVP detections which might occur during ESD or lightning events. If the output voltage exceeds the OVP trip level a few times and not again in a subsequent cycle, the internal counter will count down with twice the speed compared with counting-up. However, when typical 10 cycles of subsequent OVP events are detected, the IC assumes a true OVP and the OVP circuit switches the power MOSFET off. Next, the controller waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level.
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
Regarding the TEA1506, the IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommences when the VCC voltage drops below a level of about 4.5 V. Regarding the TEA1506A, when the Vstart level is reached, switching starts again (safe restart mode) when the Vstart level is reached. This process is repeated as long as the OVP condition exists. The output voltage Vo(OVP) at which the OVP function trips, can be set by the demagnetization resistor, RDEM: V o ( OVP ) = Ns ----------- { I (OVP)(DEM) x R DEM + V clamp(DEM)(pos) } N aux where Ns is the number of secondary turns and Naux is the number of auxiliary turns of the transformer. Current I(OVP)(DEM) is internally trimmed. The value of RDEM can be adjusted to the turns ratio of the transformer, thus making an accurate OVP possible.
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Valley switching A new cycle starts when the power MOSFET is switched on (see Fig.9). After the `on-time' (which is determined by the `sense' voltage and the internal control voltage), the switch is opened and the secondary stroke starts. After the secondary stroke, the drain voltage shows an oscillation 1 with a frequency of approximately ---------------------------------------------2 x x ( Lp x Cd ) where Lp is the primary self inductance of the transformer and Cd is the capacitance on the drain node. As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for the
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 9 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the oscillator signal. In an optimum design, the reflected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is very possible, preventing large 1 2 capacitive switching losses P = -- x C x V x f 2 and allowing high frequency operation, which results in small and cost effective inductors.
handbook, full pagewidth
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.9 Signals for valley switching.
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
Short winding protection
handbook, halfpage
MGU236
Vsense(max) 0.52 V (typ)
0.3 V (typ)
After the leading edge blanking time, the short winding protection circuit is activated. If the `sense' voltage exceeds the short winding protection voltage Vswp, the converter will stop switching. Once VCC drops below the UVLO level, capacitor CVCC will be recharged and the supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode). The short winding protection will also protect in case of a secondary diode short-circuit.
-100 A (typ)
IDEM
-24 A (typ)
OverTemperature Protection (OTP) An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will enter the safe restart mode. When the Vstart level is reached, switching starts again. This process is repeated as long as the OTP condition exists.
Fig.10 OPP correction curve.
OverCurrent Protection (OCP) The cycle-by-cycle peak drain current limit circuit uses the external source resistor to measure the current accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time, tleb. The OCP circuit limits the `sense' voltage to an internal level. OverPower Protection (OPP) During the primary stroke, the rectified mains input voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according V aux N x V mains to the following formula: I DEM -------------- -------------------------R DEM R DEM N aux where: N = ----------Np The current information is used to adjust the peak drain current, which is measured via pin Isense. The internal compensation is such that an almost mains independent maximum output power can be realized. The OPP curve is given in Fig.10.
2003 Sep 09
10
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
Control pin protection If pin CTRL is open-circuit or not connected, a fault condition is assumed and the converter will stop switching. Operation will recommence as soon as the fault condition is removed. Soft start-up
0.5 V
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
handbook, halfpage
ISS
To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin Isense and the sense resistor (see Fig.11). An internal current source charges the capacitor to V = ISS x RSS, with a maximum of approximately 0.5 V. The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS. V ocp - ( I SS x R SS ) I primary(max) = ---------------------------------------------R sense = R SS x C SS The charging current ISS will flow as long as the voltage on pin Isense is below approximately 0.5 V. If the voltage on pin Isense exceeds 0.5 V, the soft start current source will start limiting the current ISS. At the VCC(start) level, the ISS current source is completely switched off. Since the soft start current ISS is supplied from pin DRAIN, the RSS value will not affect the VCC current during start-up. Driver
start-up RSS 5 Isense
Vocp
CSS
Rsense
MGU237
Fig.11 Soft start.
The driver circuit to the gate of the power MOSFET has a current sourcing capability of 135 mA typical and a current sink capability of 560 mA typical. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen to limit the V/t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense.
2003 Sep 09
11
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL Voltages VCC VCTRL VDEM Vsense VDRAIN Currents ICTRL IDEM Isense IDRIVER IDRAIN General Ptot Tstg Tj Vesd total power dissipation storage temperature operating junction temperature electrostatic discharge voltage all pins except pins DRAIN and VCC pins DRAIN and VCC any pin Notes 1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. 2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 100 UNIT K/W HBM class 1; note 2 HBM class 1; note 2 MM; note 3 - - - 2000 1500 400 V V V Tamb < 70 C - -55 -20 0.75 +150 +145 W C C current on pin CTRL current on pin DEM current on pin Isense current on pin DRIVER current on pin DRAIN d < 10 % - -250 -1 -0.8 - 5 +250 +10 +2 5 mA A mA A mA supply voltage voltage on pin CTRL voltage on pin DEM voltage on pin Isense voltage on pin DRAIN current limited current limited continuous -0.4 -0.4 -0.4 -0.4 -0.4 +20 +5 - - +650 V V V V V PARAMETER CONDITIONS MIN. MAX. UNIT
QUALITY SPECIFICATION In accordance with `SNW-FQ-611-D'.
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
CHARACTERISTICS Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. SYMBOL PARAMETER CONDITIONS VCC < Vstart VCC > Vstart MIN. - - 650 TYP. MAX. - - - UNIT A A V
Start-up current source (pin DRAIN) IDRAIN BVDSS supply current drawn from pin DRAIN breakdown voltage 500 50 -
Supply voltage management (pin VCC) VCC(start) VCC(UVLO) VCC(hys) ICC(oper) ICC(start) ICC(protection) Vth(DEM) Iprot(DEM) start-up voltage on VCC undervoltage lock-out on VCC hysteresis voltage on VCC supply current under normal operation supply current in start-up and safe restart mode supply current while not switching VCC(start) - VCC(UVLO) 10.3 8.1 2.0 no load on pin DRIVER 1.1 VCC < Vstart VCC > VUVLO 0(1) - 50 VDEM = 50 mV IDEM = 250 A -50(2) -0.5 0.5 1.1 11 8.7 2.3 1.3 - 0.85 11.7 9.3 2.6 1.5 70 - 150 -10 -0.05 0.9 1.9 V V V mA A mA
Demagnetization management (pin DEM) demagnetization comparator threshold voltage on pin DEM protection current on pin DEM 100 - -0.25 0.7 1.5 mV nA V V s
Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = -150 A Vclamp(DEM)(pos) positive clamp voltage on pin DEM tsuppr suppression of transformer ringing at start of secondary stroke
Pulse width modulator ton(min) ton(max) Oscillator fosc(l) fosc(h) Vvco(start) Vvco(nom) oscillator low fixed frequency oscillator high fixed frequency peak voltage on pin Isense; where frequency reduction starts peak voltage on pin Isense; where the frequency is equal to fosc(l) minimum voltage on pin CTRL for maximum duty cycle maximum voltage on pin CTRL for minimum duty cycle protection current on pin CTRL VCTRL = 1.5 V VCTRL > 1.5 V VCTRL < 1 V see Figs 7 and 8 20 145 - - 25 175 VCO1 VCO1 - 50 30 205 - - kHz kHz mV mV minimum on-time maximum on-time latched - 40 tleb 50 - 60 ns s
Duty cycle control (pin CTRL) VCTRL(min) VCTRL(max) Iprot(CTRL) - - -1(2) 1.0 1.5 -0.8 - - -0.5 V V A
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
CONDITIONS MIN. -85 - - 150(2) TYP. MAX. +85 - UNIT
SYMBOL Valley switch (pin DRAIN) V/tvalley tvalley-swon
PARAMETER
valley recognition voltage change delay from valley recognition to switch-on V/t = 0.1 V/s V/t = 0.5 V/s
V/s ns
Overcurrent and short winding protection (pin Isense) Vsense(max) tPD Vswp tleb ISS IOVP(DEM) maximum source voltage OCP propagating delay from detecting Vsense(max) to switch-off short winding protection voltage blanking time for current and short winding protection soft start current Vsense < 0.5 V set by resistor RDEM; see Section "OverVoltage Protection (OVP)" 0.48 - 0.83 300 45 0.52 140 0.88 370 60 0.56 185 0.96 440 75 V ns V ns A A
Overvoltage protection (pin DEM) OVP level on pin DEM 54 60 66
Overpower protection (pin DEM) IOPP(DEM) OPP current on pin DEM to start OPP correction set by resistor RDEM; see Section "OverPower Protection (OPP)" - -24 - A
IOPP50%(DEM)
OPP current on pin DEM; where maximum source voltage is limited to 0.3 V
-
-100
-
A
Driver (pin DRIVER) Isource Isink source current capability of driver sink current capability of driver VCC = 9.5 V; VDRIVER = 2 V VCC= 9.5 V; VDRIVER = 2 V VCC = 9.5 V; VDRIVER = 9.5 V Vo(max) maximum output voltage of the driver VCC > 12 V - - - - -135 240 560 11.5 - - - 12 mA mA mA V
Overtemperature protection Tprot(max) Tprot(hys) Notes 1. For VCC 2 V. 2. Guaranteed by design. maximum temperature protection level hysteresis for the temperature protection level 130 - 140 8(2) 150 - C C
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
APPLICATION INFORMATION
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
A converter with the TEA1506 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit. Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the resistor RS during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the maximum primary peak current.
handbook, full pagewidth Vmains
Vi Ci
Do
Vo
RS VCC CVCC GND CTRL DEM 8 DRAIN 7 6 5 HVS n.c.
Np 1 2 3 4
Ns
Co
CCTRL RCTRL
TEA1506P TEA1506AP
DRIVER Isense RSS CSS
power MOSFET
Rsense
Dmicro
VC
RDEM MICROCONTROLLER
Naux
Cmicro
Rreg1
Rreg2
MDB508
Fig.12 Flyback configuration with secondary sensing.
2003 Sep 09
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Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
handbook, full pagewidth
Vi
VD (power MOSFET)
Vi
Vo
VCC
Vgate
VC
start-up sequence
normal operation
overvoltage protection (TEA1506AP/TEA1506AT)
output short-circuit
normal operation
MDB509
Fig.13 Typical waveforms.
2003 Sep 09
16
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
2003 Sep 09
17
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2003 Sep 09
18
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and 2003 Sep 09 19
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 220 C (SnPb process) or below 245 C (Pb-free process) - for all the BGA and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 235 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Suitability of IC packages for wave, reflow and dipping soldering methods MOUNTING PACKAGE(1) suitable(3) not suitable not suitable not suitable(5) SOLDERING METHOD WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Through-holesurface mount Surface mount PMFP(9) BGA, LBGA, LFBGA, SQFP, SSOP-T(4), TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(6), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 6. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 9. Hot bar soldering or manual soldering is suitable for PMFP packages. REFLOW(2) DIPPING - not suitable suitable suitable suitable - - -
suitable not recommended(6)(7) not recommended(8)
suitable suitable suitable
- - -
2003 Sep 09
20
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Sep 09
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/01/pp22
Date of release: 2003
Sep 09
Document order number:
9397 750 11434

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